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Standard Detayı
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TÜRK STANDARDI
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TS No :
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TS EN IEC 60068-2-20
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Kabul Tarihi :
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30.09.2021
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Hazırlık Grubu :
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Teknik Kurul |
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Doküman Tipi :
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Yürürlük Durumu :
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U (Yürürlükteki Standard/Standard) |
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Başlık :
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Çevre şartlarına dayanıklılık deneyleri - Bölüm 2-20: Deneyler - Deney Ta ve Tb: Uçları olan elemanların lehimleme sıcaklığına dayanıklılığı ve lehimlenebilirliği için deney yöntemleri |
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Başlık (İng) :
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Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads |
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Kapsam :
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Kapsam (İng) :
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This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads
themselves. Soldering tests for surface mounting devices (SMD) are described in
IEC 60068-2-58.
This document provides procedures for determining the solderability and resistance to soldering
heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead
(Pb), or lead-free alloys.
The procedures in this document include the solder bath method and soldering iron method.
The objective of this document is to ensure that component lead or termination solderability
meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition,
test methods are provided to ensure that the component body can be resistant to the heat load
to which it is exposed during soldering.
NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance.
IEC 60068-2-69 (solder bath and solder globule method) can be consulted. |
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Yerini Aldığı :
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TS EN 60068-2-20 :2009; TS EN 60068-2-20 :2009; |
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Yararlanılan Kaynak :
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EN IEC 60068-2-20:2021 |
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Uluslararası Karşılıklar :
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EN IEC 60068-2-20-EQV; IEC 60068-2-20-EQV |
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ICS Kodu :
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19.040 Çevresel Deneyler |
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Cen/Cenelec :
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CENELEC/IEC |
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Dili :
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en |
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Renk Durumu :
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Siyah-Beyaz |
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Uygulama Durumu :
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Yürürlükte |
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Sayfa Sayısı :
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31 |
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Fiyatı :
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72,00 EURO (2.732,93 TL + %10 Kdv) |
| Çakışan Standart Varsa İptal Tarihi (DOW) | - |
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